Method and apparatus for high electrical and thermal performance ball grid array package
US6949823B2 · kind B2 · utility
6Cited by
2References
21Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jan 30, 2004 |
| Grant date | Sep 27, 2005 |
| Priority date | — |
| Expiry date | Jan 30, 2024 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3011
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A high electrical and thermal performance thick film ceramic ball grid array package with a laser cut die cavity is presented. The thick film ceramic ball grid array package may have a thick film ceramic substrate with a first side and a second side with a heat spreader or a heat sink on the second side. An IC die may be attached to the heat spreader or heat sink through the laser cut die cavity and wire bonded to pads on the first side of the ceramic substrate. The thick film ceramic substrate may have one or more integrated passive components.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.