Laminates for encapsulating devices

US6949825B1 · kind B1 · utility

Assignees

• OSRAM Opto Semiconductors GmbH · DE
• Institute of Materials Research and Engineering · SG

Inventors

• Ewald Guenther · Regenstauf, DE
• Wei-Jun Wang · Nanhu, CN
• Soo Jin Chua · Singapore, SG

Key dates

• Filing date: Jul 9, 1999
• Grant date: Sep 27, 2005
• Expiry date: Jul 9, 2019

Classification

• Technology area (CPC H): Electricity
• CPC primary: H10K2102/311

Abstract

An encapsulation for an electrical device is disclosed. The encapsulation comprises plastic substrates which are laminated onto the surface of the electrical device. The use of laminated plastics is particularly useful for flexible electrical devices such as organic LEDs.