Patent · US Expired

System and method of providing highly isolated radio frequency interconnections

US6949992B2 · kind B2 · utility

8Cited by
30References
27Claims
0Family size

Assignee

Inventors

Key dates

Filing dateMar 20, 2002
Grant dateSep 27, 2005
Priority date
Expiry dateMay 28, 2022

Classification

  • Technology area (CPC H)Electricity
  • CPC primaryH05K2201/09727
  • WIPO fieldTelecommunications
  • WIPO sectorElectrical engineering

Abstract

A surface mount technology (“SMT”) apparatus for use in routing radio frequencies (“RF”) between cavities that require a high level of isolation on a single printed circuit board (“PCB”). The SMT part is attached to the PCB over a stripline-ready trace which transitions to microstrip before and after the SMT stripline part to maintain consistent characteristic impedance. When presented with a high isolation need between two cavities using microstrip transmission lines, the proposed stripline SMT apparatus under the isolation wall will tend to provide the necessary isolation. The present invention provides a repeatable and reliable interconnect while improving the electrical match between the two cavities. Furthermore, the invention removes the costs associated with manually forming and soldering cables between PCBs.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.