Power amplifier module assembly
US6950309B2 · kind B2 · utility
1Cited by
10References
14Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 25, 2004 |
| Grant date | Sep 27, 2005 |
| Priority date | — |
| Expiry date | Feb 25, 2024 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K7/209
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A power amplifier module assembly (100) includes a PA module (102) having a flange (104) and a mounting bracket (106) coupled thereto. A thermally conductive pad (108) having an electrically conductive surface (110) that couples to the mounting bracket (106) and the flange (104) via a chassis (204) so as to provide both shielding and thermal dissipation to the PA module (102).
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.