High frequency module mounting structure in which solder is prevented from peeling
US6950315B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | May 19, 2003 |
| Grant date | Sep 27, 2005 |
| Priority date | — |
| Expiry date | Oct 9, 2023 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02P70/50
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
In a high-frequency module mounting structure according to the present invention, a circuit board includes a reinforcing electrode on the lower surface thereof for increasing a mounting strength of the first and second electrode groups in a state of being in close proximity, a motherboard includes a reinforcing lands corresponding to the reinforcing electrodes in a state of being in close proximity to the lands, and the electrodes and the lands, and the reinforcing electrodes and the reinforcing lands are soldered. Therefore, soldering of the high-frequency module with respect to the motherboard is enhanced, and thus a reliable high-frequency module mounting structure is provided.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.