Tooling frame able to adhere to tin
US6951299B2 · kind B2 · utility
0Cited by
11References
13Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 1, 2002 |
| Grant date | Oct 4, 2005 |
| Priority date | — |
| Expiry date | Dec 6, 2023 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/046
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A tooling frame with an ability to adhere to tin is disclosed, which is a frame structure used to support a circuit board passing through a stannic furnace to be soldered. The tooling frame is characterized in that a tin adhesive apparatus having a tin adhesive material is mounted at an appropriate location of the tooling frame so as to suck surplus tin on said circuit board both after the circuit board is transported through the stannic furnace for tin filling and during tin shedding and to improve quality of soldering.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.