Method of drilling holes with precision laser micromachining
US6951627B2 · kind B2 · utility
53Cited by
17References
8Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 24, 2002 |
| Grant date | Oct 4, 2005 |
| Priority date | — |
| Expiry date | Jul 3, 2023 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB23K2103/50
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
The invention is an apparatus and a method for drilling holes in a work piece with a laser. A laser beam is received by the optical system and directed along an optical path. The system directs the laser beam through a moveable mask aperture creating a sub-beam, that is reduced in size by a lens system as it is imaged onto a work piece. Multiple features are formed in the work piece by moving the mask.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.