Method of manufacturing an implantable device feedthrough assembly
US6951664B2 · kind B2 · utility
2Cited by
4References
23Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 24, 2004 |
| Grant date | Oct 4, 2005 |
| Priority date | — |
| Expiry date | Jun 24, 2024 |
Classification
- Technology area (CPC A)Human Necessities
- CPC primaryA61N1/3754
- WIPO fieldMedical technology
- WIPO sectorInstruments
Abstract
An implantable component including a feedthrough assembly and a method for forming the feedthrough assembly wherein a coating forming a fluid barrier over an insulator, an insulator-to-terminal pin interface and an insulator-to-ferrule interface is incorporated.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.