Patent · US Expired

Method relating to anodic bonding

US6951797B1 · kind B1 · utility

0Cited by

7References

19Claims

0Family size

Assignee

Imego AB · SE

Inventors

Leif Bergstedt · Borås, SE
Gert Andersson · Lindome, SE
Britta Ottosson · Timrå, SE

Key dates

Filing date	Oct 17, 2000
Grant date	Oct 4, 2005
Priority date	—
Expiry date	Jun 25, 2021

Classification

Technology area (CPC H)Electricity
CPC primaryH01L2924/16235
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

The present invention relates to a method of bonding a first member (110, 210, 130, 230, 410, 430, 510, 530, 610) to a second silicon member (120, 220, 420a, 420b, 600) through anodic bonding. The method comprises the steps of selectively depositing on said first member bondable sections (170a, 170b, 270, 470a, 470b, 470c, 570, 620) before bringing said first and second members together for anodic bonding.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.