Etched open microchannel spray cooling
US6952346B2 · kind B2 · utility
68Cited by
26References
10Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 24, 2004 |
| Grant date | Oct 4, 2005 |
| Priority date | — |
| Expiry date | Feb 28, 2024 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K7/20345
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
The present invention is a spray cooling thermal management device that cools an electronic component. Liquid coolant is dispensed upon a heated surface containing etched open microchannels.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.