Method and apparatus for call setup latency reduction
US6952411B2 · kind B2 · utility
28Cited by
7References
5Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 29, 2002 |
| Grant date | Oct 4, 2005 |
| Priority date | — |
| Expiry date | Apr 29, 2022 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH04W76/19
- WIPO fieldDigital communication
- WIPO sectorElectrical engineering
Abstract
Techniques for minimizing call setup latency are disclosed. In one aspect, multiple signaling messages are encapsulated and sent as a single message thus reducing the total delay incurred by sequential transmission. In one embodiment, an encapsulation message includes a field indicating the number of messages encapsulated therein. In one example, the encapsulation is performed at a Link Access Control (LAC) layer. Alternate embodiments may perform encapsulation at an alternate layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.