Snap-through thermal actuator
US6953240B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 18, 2004 |
| Grant date | Oct 11, 2005 |
| Priority date | — |
| Expiry date | Dec 18, 2024 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB41J2002/14346
- WIPO fieldTextile and paper machines
- WIPO sectorMechanical engineering
Abstract
A snap-through thermal actuator for a micro-electromechanical device, for example, a liquid drop emitter or a fluid control microvalve, is disclosed. The snap-through actuator includes a base element formed with a depression having opposing anchor edges which define a central plane. A deformable element, attached to the base element at the opposing anchor edges, is constructed as a planar lamination including a first layer of a first material having a low coefficient of thermal expansion and a second layer of a second material having a high coefficient of thermal expansion. The deformable element is formed to have a residual shape bowing outward from the central plane in a first direction away from the second layer. The snap-through thermal actuator further includes apparatus adapted to apply a heat pulse to the deformable element which causes a sudden rise in the temperature of the deformable element.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.