Device for thermal treatment of substrates

US6953338B2 · kind B2 · utility

Assignee

• Steag RTP Systems GmbH · DE

Inventors

• Uwe Kreiser · Ulm, DE
• Karsten Weber · Leutenbach, DE
• Wilfried Lerch · Blaustein, DE
• Michael Grandy · Warrington, US
• Patrick Schmid · Muttenz, CH
• Jürgen Niess · Sontheim, DE
• Olgun Altug · Ulm, DE

Key dates

• Filing date: Jan 19, 2001
• Grant date: Oct 11, 2005
• Expiry date: Jan 19, 2021

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01L21/68785
• WIPO field: Semiconductors
• WIPO sector: Electrical engineering

Abstract

The aim of the invention is to reduce the formation of scratches in a device for the thermal treatment of substrates, in particular, semiconductor substrates, in a chamber in which the substrate is placed upon support elements. According to the invention, said aim is achieved by means of displaceable support elements.