Composite material
US6953539B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Sep 18, 2002 |
| Grant date | Oct 11, 2005 |
| Priority date | — |
| Expiry date | Jul 11, 2023 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/249974
- WIPO fieldMaterials, metallurgy
- WIPO sectorChemistry
Abstract
A composite material includes an SiC porous ceramic sintered body, which is formed by preliminarily sintering a porous body, having a coefficient of thermal expansion lower than the coefficient of thermal expansion of copper to construct a network therein. A copper alloy impregnating the porous ceramic sintered body includes copper and one or more additive elements which are prepared to impart a coefficient of thermal conductivity of 160 W/mK or higher to the composite material. The additive elements include up to 5% of at least one element selected from Be, Al, Si, Mg, Ti, Ni, Bi, Te, Zn, Pb, Sn, and mish metal, and also contain unavoidable impurities and gas components.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.