Conductive film forming composition, conductive film, and method for forming the same
US6953600B2 · kind B2 · utility
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4Claims
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Key dates
| Filing date | Apr 10, 2003 |
| Grant date | Oct 11, 2005 |
| Priority date | — |
| Expiry date | Jan 20, 2024 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/24917
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
There are provided a conductive film forming composition capable of forming wiring or an electrode which can be suitably used in a variety of electronic devices, easily and inexpensively, a method for forming a film using the composition, a conductive film formed by the method, and wiring or an electrode which comprises the film.A conductive film forming composition comprising a complex of an amine compound and aluminum hydride and an organic solvent is applied on a substrate and then subjected to a heat treatment and/or irradiation with light, whereby a conductive film such as an electrode or wiring is produced.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.