Patent · US Expired

Photosensitive composition for photoresist manufacture

US6953649B2 · kind B2 · utility

29Cited by
9References
17Claims
0Family size

Assignee

Inventors

Key dates

Filing dateJun 1, 2001
Grant dateOct 11, 2005
Priority date
Expiry dateNov 17, 2021

Classification

  • Technology area (CPC Y)Emerging Cross-Sectional Technologies
  • CPC primaryY10S430/106
  • WIPO fieldMacromolecular chemistry, polymers
  • WIPO sectorChemistry

Abstract

The invention concerns a novel photosensitive composition for photoresist and a system comprising a substrate and a photoresist obtained from said novel composition. The photosensitive composition for photoresist comprises a copolymer with hydrophobic blocks whereof at least one block is an hydrophobic block capable of generating a hydrophilic block and comprising at its end a group selected among dithioesters, thioesters-thiones, dithiocarbamates and xanthates, and a photoactive compound capable of generating under the effect of a radiation an active species reacting with the hydrophobic block to generate the hydrophilic block.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.