Methods for making microwave circuits
US6953698B2 · kind B2 · utility
2Cited by
8References
8Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 19, 2003 |
| Grant date | Oct 11, 2005 |
| Priority date | — |
| Expiry date | Jun 19, 2023 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/1476
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
Disclosed are methods for making microwave circuits using thickfilm components, the thickfilm components including: a first, multi-layer thickfilm dielectric deposited on a ground plane; a thickfilm conductor deposited on the first thickfilm dielectric; a second, multi-layer thickfilm dielectric deposited on the first dielectric and conductor to encapsulate the conductor; a thickfilm ground shield layer deposited over the first and second dielectrics; and thickfilm resistors deposited in close proximity to the first and second dielectrics.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.