Flexible skin incorporating MEMS technology
US6953982B1 · kind B1 · utility
12Cited by
6References
15Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 9, 2000 |
| Grant date | Oct 11, 2005 |
| Priority date | — |
| Expiry date | Oct 1, 2021 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2224/24137
- WIPO fieldMicro-structural and nano-technology
- WIPO sectorChemistry
Abstract
A flexible skin formed of silicon islands encapsulated in a polyimide film. The silicon islands preferably include a MEMS device and are connected together by a polyimide film (preferably about 1–100 μm thick). To create the silicon islands, silicon wafers are etched to a desirable thickness (preferably about 10–500 μm) by Si wet etching and then patterned from the back side by reactive ion etching (RIE).
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.