Leadframes for high adhesion semiconductor devices and method of fabrication
US6953986B2 · kind B2 · utility
13Cited by
9References
1Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 8, 2000 |
| Grant date | Oct 11, 2005 |
| Priority date | — |
| Expiry date | Jun 11, 2022 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02P70/50
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A leadframe for use in the assembly of integrated circuit chips comprising a base metal structure having an adherent layer of nickel covering said base metal; an adherent film of palladium on said nickel layer; and an adherent layer of palladium on said palladium film, selectively covering areas of said leadframe suitable for bonding wire attachment and solder attachment.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.