Land grid array structure
US6954984B2 · kind B2 · utility
6Cited by
7References
17Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 25, 2002 |
| Grant date | Oct 18, 2005 |
| Priority date | — |
| Expiry date | Mar 3, 2023 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49169
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A Land Grid Array structure is enhanced with a flex film interposer that not only provides a Land Grid Array (LGA) electrical connection between a Multi-Chip Module (MCM) and the next level of integration such as a system board, but also provides a reliable means to implement desired Engineering Change (EC) capability as well as a means for decoupling power to ground structure to minimize switching activity effects on the System. The invention as described can be implemented for EC repair, for Capacitive Decoupling or both.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.