Method of interconnecting a circuit board to a substrate
US6954987B2 · kind B2 · utility
2Cited by
10References
9Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 19, 2004 |
| Grant date | Oct 18, 2005 |
| Priority date | — |
| Expiry date | May 19, 2024 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49165
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A printed circuit board assembly employing a solder vent hole adjacent solder filled interconnect vias connecting to a conductive pallet, is disclosed. The solder vent hole allows gases to escape from an otherwise sealed cavity during solder reflow, relieving positive pressure and thereby allowing solder to flow into it. By providing an escape path for trapped air and gases generated during solder paste reflow, the out-gassing pressure and weight of the molten solder is sufficient to allow the solder paste to flow into the cavity.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.