Packages for housing optoelectronic assemblies and methods of manufacture thereof
US6955483B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Dec 30, 2003 |
| Grant date | Oct 18, 2005 |
| Priority date | — |
| Expiry date | Dec 30, 2023 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG02B6/4207
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
A package for housing an optoelectronic device such as a photodiode or laser diode is disclosed. The package includes a base having an upper surface. The photodiode chip and related circuitry are mounted to the upper surface of the base. A fiber receptacle structure is mounted to the base and hermetically encloses the photodiode/laser diode chip without the need for a separate cap and lens structure. In the event insulating base is utilized, the plurality of via holes are preferably drilled through the base and the via holes are filled with conductive material thereby enabling the fiber receptacle structure to be hermetically welded to the insulating base using the disclosed process.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.