Method for adhering substrates using ultraviolet activatable adhesive film and an ultraviolet irradiation apparatus
US6955739B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | May 24, 2002 |
| Grant date | Oct 18, 2005 |
| Priority date | — |
| Expiry date | Sep 21, 2022 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/1121
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
The invention provides a method for adhering two substrates comprising: providing an adhesive film having a first surface and a second surface; irradiating the adhesive film with ultraviolet radiation to provide an activated adhesive film having a first activated surface and a second activated surface; cooling the activated adhesive film either while irradiating or immediately after irradiating the film; contacting the first activated surface with a first substrate; contacting the second activated surface with a second substrate; and applying heat and pressure to the first and second substrates to cure the activated adhesive film and to bond the substrates to one another.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.