Wafer-level packaging of optical receivers
US6955934B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Sep 9, 2004 |
| Grant date | Oct 18, 2005 |
| Priority date | — |
| Expiry date | Oct 4, 2024 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/10253
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
A sub-assembly or package for a die in the receiving section of an optical transceiver includes a semiconductor sub-mount that is electrically connected to the die and a cap that is bonded to the sub-mount to hermetically seal the die in a cavity. The die can be flip-chip bonded to the sub-mount and can include a diffractive optical element fabricated on a back side of the die. Active circuitry such as an amplifier for an output signal from a photosensor on the die can be integrated into the sub-mount. For an OSA, a post can be attached to the package along a path of an optical signal to the photosensor. The post facilitates alignment of an optical fiber. A flexible or rigid circuit can be soldered to external terminals of the sub-mount.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.