Filled polyamide molding materials having improved processing behavior
US6956081B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 13, 2002 |
| Grant date | Oct 18, 2005 |
| Priority date | — |
| Expiry date | Aug 8, 2023 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08L77/06
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
The invention relates to reinforced thermoplastic polyamide molding materials having simultaneously good surface quality, good flowability and good heat dimensional stability, from polyamide compositions on the basis of semi-crystalline semi-aromatic polyamides and copolyamides having a melting point of at least 240° C. (A) and amorphous (co)polyamides (B).The molded articles produced by the molding materials according to the present invention are used for production of interior and exterior parts, especially having structural or mechanical function in the fields of electric components, electronics, telecommunication, automobile, transport, packaging, domestic, furniture, sports, apparatus engineering, machine construction, heating installation, air conditioning, and sanitation.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.