High modulus polyimide compositions useful as dielectric substrates for electronics applications, and methods relating thereto
US6956098B2 · kind B2 · utility
5Cited by
22References
46Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 20, 2002 |
| Grant date | Oct 18, 2005 |
| Priority date | — |
| Expiry date | Oct 6, 2022 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/31721
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
The substrates of the present invention comprise a polyimide base polymer derived at least in part from collinear monomers together with crankshaft monomers. The resulting polyimide material has been found to provide advantageous properties, particularly for electronics type applications.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.