Semiconductor light-emitting device having a semiconductor light-emitting element mounted on a substrate with anisotropically conductive adhesive interposed therebetween
US6956242B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Jul 2, 2003 |
| Grant date | Oct 18, 2005 |
| Priority date | — |
| Expiry date | Nov 12, 2023 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/12041
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor light-emitting element 1 is mounted on a substrate 2 with an anisotropically conductive adhesive 3, which has electrically conductive particles 32 dispersion-mixed with a thermosetting resin 31, laid between a pair of electrodes 11 and 11′ formed on the same surface of the semiconductor light-emitting element and wiring electrodes 21 and 21′ formed on the substrate 2. Depressions 22 and 22′ are formed in the portion of the surface of the wiring electrodes 21 and 21′ facing the semiconductor light-emitting element 1 so that the electrically conductive particles 32 are stably present between the pair of electrodes 11 and 11′ and the wiring electrodes 21 and 21′.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.