Heat transfer apparatus for burn-in board
US6956392B2 · kind B2 · utility
12Cited by
22References
11Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Dec 30, 2003 |
| Grant date | Oct 18, 2005 |
| Priority date | — |
| Expiry date | Dec 30, 2023 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01R31/2863
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
An apparatus for transferring heat from semiconductor devices during a burn-in operation is disclosed. The apparatus includes a substantially planar base board through which a plurality of openings are extended. Heat sinks coordinated with the openings are connected to biasing members and come in contact with the semiconductor devices during the burn-in operation for transferring heat from the devices.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.