High temperature stable thermal interface material
US6956739B2 · kind B2 · utility
17Cited by
56References
52Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | May 7, 2003 |
| Grant date | Oct 18, 2005 |
| Priority date | — |
| Expiry date | May 7, 2023 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/31938
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A thermally-conductive interface interposable intermediate a first heat transfer surface and an opposing second heat transfer surface to provide a thermal pathway therebetween. The interface includes a thermally-conductive compound formed into a layer which is conformable between the first and second heat transfer surface. The compound is an admixture of: (a) a liquid resin constituent; and (b) a particulate filler constituent. The liquid resin constituent may be an ethylene-propylene copolymer (EPM) or a terpolymer (EPDM) of ethylene and propylene and a diene which may be ethylidene norbornene (ENB) or dicyclopentadiene (DCPD).
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.