Adhesive type LED lead frame
US6957898B2 · kind B2 · utility
Inventor
Key dates
| Filing date | Apr 30, 2003 |
| Grant date | Oct 25, 2005 |
| Priority date | — |
| Expiry date | Oct 14, 2023 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S362/80
Abstract
An adhesive type LED lead frame includes a crystal base, a positive pole plate, a base joint and a flat joint. The crystal base is a conductive solid base and has a base part at the center thereof with a locating recess with a lower thin adhesive part at two opposite sides thereof respectively. The positive pole plate is disposed at a lateral side of the crystal base with a flat joining part parallel to the adhesive parts, having a connecting part with a sense of direction corresponding the base part. The base joint and the flat joint are disposed between the crystal base and the positive pole plate and provide a very thin thickness respectively. The base joint is removed before a solid crystal or a chip being placed in the base part and connecting wires thereof being packaged. Also, the flat joint is removed after the packaging job so as to constitute two poles adhered to a circuit board.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.