Optimized contact design for flip-chip LED

US6958498B2 · kind B2 · utility

Assignee

• EMCORE CORPORATION · US

Inventors

• Bryan Shelton · Bound Brook, US
• Ivan Eliashevich · Maplewood, US
• Hari Venugopalan · Somerville, US

Key dates

• Filing date: Sep 27, 2002
• Grant date: Oct 25, 2005
• Expiry date: Nov 10, 2022

Classification

• Technology area (CPC H): Electricity
• CPC primary: H10H20/819

Abstract

Light emitting diodes are provided with electrode and pad structures that facilitate current spreading and heat sinking. A light emitting diode may be formed as a die with a stacked structure having a first region and a mesa projecting from a surface of the first region. A first electrode may substantially cover the mesa and have a plurality of pads disposed thereon maximizing a contact area in relation to the first electrode. A second electrode may be disposed as a trace on the surface of the first region, the trace having a spiral, segmented/interdigitated, loop or pattern. Optionally, the trace includes corner spikes projecting outwardly toward edges of the first electrode.