Hermetic high frequency module and method for producing the same

US6958669B2 · kind B2 · utility

Assignee

• EADS Deutschland GmbH · DE

Inventors

• Markus Grupp · Dennjächt, DE
• Dieter Schmidt · Steinhagen, DE

Key dates

• Filing date: Jun 6, 2001
• Grant date: Oct 25, 2005
• Expiry date: Jul 12, 2021

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01L2924/0002
• WIPO field: Semiconductors
• WIPO sector: Electrical engineering

Abstract

The invention relates to a high frequency module with a hollow conductor structure, consisting of a housing bottom and a housing lid, preferably consisting of ceramic. The housing bottom and the housing lid are preferably coordinated with each other in terms of their expansion characteristics. The adjusting device is mounted on the housing lid for positioning on the housing bottom, and consists of a raised photosensitive resist part which tapers conically starting from the housing lid. The adjusting device engages with the hollow conductor on assembly. The layer thickness of the adjusting device is approximately 100 to 200 μm. The housing bottom and the housing lid are permanently interconnected by soldering, preferably using solders which are introduced galvanically in solder deposits. To this end, the solder is either applied locally to the housing lid surface or introduced in vias which are structured in the lid.