Method and apparatus for cooling a modular computer system with dual path airflow
US6958906B2 · kind B2 · utility
Inventors
Key dates
| Filing date | Apr 11, 2003 |
| Grant date | Oct 25, 2005 |
| Priority date | — |
| Expiry date | Apr 11, 2023 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG06F1/20
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A computer system and a method for cooling the system incorporate removable modules within a housing. The housing includes a parallelepiped structure with at least four walls. The four walls include at least two sets of opposing walls. Both walls of one set of opposing walls include opposing first and second openings substantially aligned with each other to allow passage of a cooling medium therethough. The module is receivable through a third opening in the parallelepiped structure and includes an electrical component region. The housing includes a first airflow path in-line with the third opening and a second airflow path between the first opening and the second opening. The first airflow path and the second airflow path are directed across the component region of the module when the module is received within the housing.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.