Printed board unit for optical transmission and mounting method
US6959125B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jan 14, 2003 |
| Grant date | Oct 25, 2005 |
| Priority date | — |
| Expiry date | Aug 1, 2023 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2224/73257
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
It is an object of the present invention to enhance laser beam transmitting efficiency by accurately controlling an interval between a light emitting (light receiving) element (20) and an optical wave-guide substrate (1) without causing any fluctuation in the interval in a mounting structure of the light transmitting element in which the light emitting (light receiving) element (20) is mounted on the optical wave-guide substrate (1). When the light emitting (light receiving) element is joined to the sub-mount chip (4) and when the sub-mount chip (4) is joined to the optical wave-guide while the element is being directed to the substrate side, the sub-mount chip and the optical wave-guide substrate are joined to each other by the solder bump (6). A post (5) is arranged for regulating an interval between the light emitting (light receiving) element and the optical wave-guide substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.