Patent · US Expired

Apparatus and method of packaging two dimensional photonic array devices

US6960031B2 · kind B2 · utility

24Cited by
4References
25Claims
0Family size

Assignee

Inventors

Key dates

Filing dateDec 19, 2002
Grant dateNov 1, 2005
Priority date
Expiry dateJun 4, 2023

Classification

  • Technology area (CPC G)Physics
  • CPC primaryG02B6/4249
  • WIPO fieldOptics
  • WIPO sectorInstruments

Abstract

An optical coupler for forming an optical connection between one or more two dimensional photonic array devices and an optical fiber and for forming an electrical connection between the two dimensional photonic array devices and a substrate, a system including the optical coupler and materials, and methods of forming the optical coupler and system are disclosed. The optical coupler includes a light transmission medium and electrical connectors, which are at least partially encapsulated. In addition, the device includes alignment guides configured to receive guide pins from a fiber optic connector, such that when the fiber optic connector is attached to the optical coupler, fibers of the ribbon align with the two dimensional photonic array device(s) via the light transmission medium.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.