Method for forming moldings from dimer fatty acid free polyamides

US6960315B2 · kind B2 · utility

Assignee

• Henkel Kommanditgesellschaft auf Aktien · DE

Inventors

• Bettina Becker · Monheim, DE
• Angela Rossini · Marsala, IT
• Thomas Moeller · Goldkronach, DE
• Thomas Huver · Goldkronach, DE
• Georg Schubert · Rheydt, DE

Key dates

• Filing date: Aug 10, 2001
• Grant date: Nov 1, 2005
• Expiry date: Nov 22, 2021

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01B3/305
• WIPO field: Macromolecular chemistry, polymers
• WIPO sector: Chemistry

Abstract

Polyamides based on reaction products of C4-C18 dicarboxylic acids and diamines are suitable as molding compositions for the production of moldings in the low pressure injection molding process, and for adhesive sealing or filling in the production of electrical or electronic devices, in particular of plugs, cables, switches, sensors, transponders, modules, printed circuit boards or smart cards. In comparison with conventional molding compositions based in known hot melt adhesives, said polyamides exhibit higher strength values, higher abrasion resistance and higher chemical resistance.