Semiconductor laser module
US6961357B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jul 31, 2003 |
| Grant date | Nov 1, 2005 |
| Priority date | — |
| Expiry date | Aug 11, 2023 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01S5/0237
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
In a semiconductor laser module, in order to sufficiently reduce the thermal stress arising in a due to the bonding of elements when they are packaged and to improve the yield of production, the semiconductor laser module is provided with a semiconductor laser element, a submount bonded to the semiconductor laser element with a solder layer in-between and thereby mounted with it, and a base mounted with this submount with another solder layer in-between. Herein, T/W≧0.15 holds, where W is the width of the submount in the direction orthogonal to the optical axis of the semiconductor laser element and T is the thickness of the submount.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.