Patent · US Expired

Method and device for drying substrate

US6962007B1 · kind B1 · utility

7Cited by
8References
7Claims
0Family size

Assignees

Inventors

Key dates

Filing dateAug 10, 1999
Grant dateNov 8, 2005
Priority date
Expiry dateAug 10, 2019

Classification

  • Technology area (CPC H)Electricity
  • CPC primaryH01L21/67034
  • WIPO fieldSemiconductors
  • WIPO sectorElectrical engineering

Abstract

A device for drying substrates which stores a plurality of substrate (1) and which comprises a processing container (3) to which cleaning fluid (2) after cleaning the substrates (1) is drained and an injection nozzle (5) for injecting drying fluid located at the terminating part of a feed pipe (4) through which liquid drying fluid is supplied, whereby an exhaust equipment is eliminated or simplified, and the drying fluid is fed smoothly.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.