Epoxy resin composition for semiconductor encapsulation, process for producing the same, and semiconductor device
US6962957B2 · kind B2 · utility
2Cited by
5References
10Claims
0Family size
Assignee
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Key dates
| Filing date | Apr 24, 2003 |
| Grant date | Nov 8, 2005 |
| Priority date | — |
| Expiry date | Mar 1, 2024 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/31511
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
An epoxy resin composition for semiconductor encapsulation comprising (A) an epoxy resin, (B) a phenolic resin, and (C) butadiene rubber particles having an average particle size of secondary particles of 100 μm or smaller and having such a size distribution that the proportion of secondary particles having a particle size of 250 μm or smaller is 97% by weight or more, and the proportion of secondary particles having a particle size of 150 μm or smaller is 80% by weight or more. Component (C) is uniformly dispersed in the composition without forming coarse agglomerates to secure low stress properties.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.