Method and apparatus for housing spliced wires on siding
US6963029B1 · kind B1 · utility
9Cited by
4References
19Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 20, 2004 |
| Grant date | Nov 8, 2005 |
| Priority date | — |
| Expiry date | Sep 20, 2024 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH02G15/10
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A housing for a spliced wire includes a base, a wall extending from an edge defining a perimeter of the base, and a cavity defined by the wall and base. The wall includes opposing sides each having an opening receptive to a wire therethrough. A cover is pivotally hinged to one edge defining the wall and is configured to close the cavity to an environment and protect a splice between each wire from the environment. A siding clip extends from either the base or wall and is configured to clip to siding of a building structure.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.