Microelectromechanical device using resistive electromechanical contact
US6963117B2 · kind B2 · utility
12Cited by
10References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 29, 2002 |
| Grant date | Nov 8, 2005 |
| Priority date | — |
| Expiry date | Oct 28, 2022 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01H2001/0057
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A microelectromechanical device that transmits an electric signal using mechanical contact between conductors is provided. The microelectromechanical device has a conductive oxide layer on at least one of contacting surfaces of the conductors. The conductor may be a signal line or a contact pad. According to the microelectromechanical device, the signal line or the contact pad is coated with the conductive oxide layer, thereby preventing the occurrence of micro-welding problem due to resistive heat. As a result, a reliability and a power handling of a microelectromechanical device can be improved.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.