System for mounting electronic device
US6964093B2 · kind B2 · utility
2Cited by
5References
2Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 26, 2001 |
| Grant date | Nov 15, 2005 |
| Priority date | — |
| Expiry date | Aug 27, 2022 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/53196
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
An electronics packaging system (1) including a printer (3), a placing unit (4) and a reflow unit (5), wherein a printed wiring board (2) is carried while being kept in an upright position. The printed wiring board (2) has solder printed on all the lands thereof at the same time, the electronic parts (10) are all placed on the lands at the same time, and the electronic parts (10) are all soldered to the lands at the same time. Thus, the system (1) can be designed more compact, and the electronic parts packaged in a shorter time.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.