Heat dissipation device
US6964295B1 · kind B1 · utility
16Cited by
6References
12Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 16, 2004 |
| Grant date | Nov 15, 2005 |
| Priority date | — |
| Expiry date | Nov 16, 2024 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A heat dissipating device assembly includes a heat receiver, a heat sink defining two opposite ends and a plurality of channels formed between the two opposite ends, a fin member cooperating with the heat receiver to enclose the heat sink except the two opposite ends, a plurality of heat pipes connecting the heat receiver with the fin member, and a fan provided adjacent one of the two opposite ends for creating airflow to flow through the channels of the heat sink. The fin member includes a plurality of fins formed at the outer surface thereof for increasing heat dissipating surface of the heat dissipating device assembly.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.