High selectivity colloidal silica slurry
US6964600B2 · kind B2 · utility
3Cited by
17References
22Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 21, 2003 |
| Grant date | Nov 15, 2005 |
| Priority date | — |
| Expiry date | Feb 18, 2024 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC09K3/1463
- WIPO fieldBasic materials chemistry
- WIPO sectorChemistry
Abstract
Provided is a novel high selectivity aqueous slurry composition method of utilizing same. The composition includes non-modified silica based abrasive particles in an amount of about 5 to about 50 weight percent, and an organic compound in an amount of about 0.001 to about 2.0 weight percent in an aqueous solution, wherein the silicon oxide to silicon nitride selectivity ratio ranges from about 50 to about 700.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.