Patent · US Expired

High selectivity colloidal silica slurry

US6964600B2 · kind B2 · utility

3Cited by
17References
22Claims
0Family size

Assignee

Inventors

Key dates

Filing dateNov 21, 2003
Grant dateNov 15, 2005
Priority date
Expiry dateFeb 18, 2024

Classification

  • Technology area (CPC C)Chemistry; Metallurgy
  • CPC primaryC09K3/1463
  • WIPO fieldBasic materials chemistry
  • WIPO sectorChemistry

Abstract

Provided is a novel high selectivity aqueous slurry composition method of utilizing same. The composition includes non-modified silica based abrasive particles in an amount of about 5 to about 50 weight percent, and an organic compound in an amount of about 0.001 to about 2.0 weight percent in an aqueous solution, wherein the silicon oxide to silicon nitride selectivity ratio ranges from about 50 to about 700.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.