Method for securing a polishing pad to a platen for use in chemical-mechanical polishing of wafers
US6964601B2 · kind B2 · utility
0Cited by
10References
10Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 9, 2003 |
| Grant date | Nov 15, 2005 |
| Priority date | — |
| Expiry date | Mar 1, 2024 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB24B37/20
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
The present invention is related to a method for securing a polishing pad to the platen for use in chemical-mechanical polishing. Specifically, a polishing pad is attached to a platen using a reclosable, hook-and-pile fastener, whereby the platen-attachment fastener may be reused. Separate embodiments are disclosed for attaching porous and nonporous polishing pads.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.