LED power package

US6964877B2 · kind B2 · utility

Assignee

• GELcore LLC · US

Inventors

• Chen-Lun Hsing Chen · North Olmsted, US
• Stanton Earl Weaver · Broadalbin, US
• Ivan Eliashevich · Maplewood, US
• Sebastien Libon · Tervuren, BE
• Mehmet Arik · Niskayuna, US
• David Mulford Shaddock · Troy, US

Key dates

• Filing date: Apr 27, 2004
• Grant date: Nov 15, 2005
• Expiry date: Apr 27, 2024

Classification

• Technology area (CPC H): Electricity
• CPC primary: H10H20/8585
• WIPO field: Semiconductors
• WIPO sector: Electrical engineering

Abstract

Surface mount light emitting diode (LED) packages each contain a light emitting diode (LED) die (24). A plurality of arrays of openings are drilled into an electrically insulating sub-mount wafer (10). A metal is applied to the drilled openings to produce a plurality of via arrays (12). The LED dice (24) are flip-chip bonded onto a frontside (16) of the sub-mount wafer (10). The p-type and n-type contacts of each flip-chip bonded LED (24) electrically communicate with a solderable backside (18) of the sub-mount wafer (10) through a via array (12). A thermal conduction path (10, 12) is provided for thermally conducting heat from the flip-chip bonded LED dice (24) to the solderable backside (18) of the sub-mount wafer (10). Subsequent to the flip-chip bonding, the sub-mount wafer (10) is separated to produce the surface mount LED packages.