Patent · US Expired

Method and production of a sensor

US6964927B2 · kind B2 · utility

1Cited by

6References

18Claims

0Family size

Assignee

Micronas GmbH · DE

Inventors

Gunter Igel · Teningen, DE
Markus Rogalla · Bad Krozingen, DE

Key dates

Filing date	Dec 7, 2001
Grant date	Nov 15, 2005
Priority date	—
Expiry date	Oct 2, 2022

Classification

Technology area (CPC H)Electricity
CPC primaryH01L2924/0002
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

The invention relates to a method for producing a sensor (1), wherein a carrier chip (2) is produced. Said chip is provided with a sensor structure (3) comprising an active sensor surface (4). A material (9) capable of flowing is applied onto carrier chips (2) in such a way that the sensor structure (3) has a thinner layer thickness on said active sensor surface (4) than on the area of the carrier chip (2) which borders on the active sensor surface (4). The material (9) which is capable of flowing is hardened thereafter. The hardened material (9) is subsequently removed by chemical means from the surface which faces said carrier chip (2) until the active sensor surface of the sensor structure is layed bare.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.