Integrated aspheric optical coupler for RF planarized automatic photonics packaging
US6965714B2 · kind B2 · utility
6Cited by
7References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 13, 2002 |
| Grant date | Nov 15, 2005 |
| Priority date | — |
| Expiry date | Sep 24, 2022 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG02B6/42
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
The invention relates to an optical, integrated alignment device for accurately aligning and efficiently coupling energy between in-plane optical devices. A semiconductor substrate is etched to include a groove for an optical fiber and a lens for passing an optical signal from a cut fiber to a photodetector. The etched semiconductor substrate may be used to pass an optical signal from a surface light emitting device to a cut fiber. The end of the optical fiber is cut at a slant that redirects an optical signal from the fiber through the lens or vice-versa. The lens focuses the optical signal onto a target.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.