Heat collector with mounting plate
US6966363B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Oct 10, 2002 |
| Grant date | Nov 22, 2005 |
| Priority date | — |
| Expiry date | Oct 10, 2022 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A heat collector (50) is formed by at least one extruding step for reducing machining steps, and is assembled to a separately formed mounting frame (40) which may be stamped and formed or molded. The heat collector has flanges (53) which bear against retaining tabs (45) formed on the mounting frame, and may be held by solder, glue, or mechanical means. The heat collector may receive a heat dissipator (18), or may be formed as a heat sink (56) such as a pin-fin type heat sink. The mounting frame can be fixed to a printed circuit board or the like having a component such as a central processing unit which contacts the collector in order to cool the unit.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.