Patent · US Expired

Fiber-free shaped parts

US6967223B1 · kind B1 · utility

1Cited by
2References
17Claims
0Family size

Assignee

Inventors

Key dates

Filing dateFeb 17, 1999
Grant dateNov 22, 2005
Priority date
Expiry dateFeb 17, 2019

Classification

  • Technology area (CPC C)Chemistry; Metallurgy
  • CPC primaryC08K3/01
  • WIPO fieldMacromolecular chemistry, polymers
  • WIPO sectorChemistry

Abstract

A fiber-free molding composition containing: (a) a binder selected from the group consisting of an epoxide, a polyisocyanate, a furane-resin-free phenolic resin, and mixtures thereof; and (b) a filler mixture containing: (i) an inorganic high-temperature-resistant filler; and (ii) a heat-activatable swelling agent.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.