Fiber-free shaped parts
US6967223B1 · kind B1 · utility
1Cited by
2References
17Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 17, 1999 |
| Grant date | Nov 22, 2005 |
| Priority date | — |
| Expiry date | Feb 17, 2019 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08K3/01
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
A fiber-free molding composition containing: (a) a binder selected from the group consisting of an epoxide, a polyisocyanate, a furane-resin-free phenolic resin, and mixtures thereof; and (b) a filler mixture containing: (i) an inorganic high-temperature-resistant filler; and (ii) a heat-activatable swelling agent.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.